March 8, 2023 - March 9, 2023
Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages.
Course Fee:
Member Rate: SGD 750
Non-member Rate: SGD 935
Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above.
This workshop is HRDC Claimable, subjecting to terms and conditions.
Certificate of completion will be awarded at the end of the workshop.
Location
Malaysian International Trade & Exhibition Centre (MITEC)
No. 8 Jalan Dutamas 2
50480 Kuala Lumpur
Kuala Lumpur
Malaysia
This course will cover:
-
Substrate and PCB fabrication processes and its key processes and materials such as ABF, BT, FR5, etc.
-
Build-up micro-via technologies with use of lasers, plasma, photo materials etc.
-
Registration and tolerances of substrate design in relation to substrate and PCB fabrication processes which includes via to pattern, pattern to resist etc, which can affect microelectronics assembly processes.
-
Materials, design and surface finishes (Cu, NiAu, ENIG , NiPdAu etc) with respect to assembly processes and parameters.
-
Substrate defects and package reliability including failure of fatigue, kirkendall voids and intermetallics.
Why should I attend?
- Provides necessary technical knowledge for industry professionals
- Enhance knowledge in manufacturing and R&D know-how in IC packaging
- Case studies discussion
- Networking Opportunity with industry peers
Who should attend?
- Directors, managers, process engineers, R&D engineers working in the areas of microelectronics
- Useful for sale or application engineers who supply packaging materials and tools to the industry
Agenda
Note: Program is subject to changes.
Introduction to IC Packaging & Interconnects
Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging
Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding
Lunch
Board Assembly and Soldering & PCB and IC Carriers
Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution
PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development
Q&A | Case Studies
End of Day 1
End of Day 1
Assembly Process
• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism
Lunch
Material Characterization Techniques
• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear
Q&A | Case Studies
Lucky Draw
End of Workshop
Sponsors
Co-Organizer
Supporting Partners
