NIST

Through SCAN, SEMI has launched new registered apprenticeship programs in Michigan and California, with the support and partnership of state agencies. In California, through funding from the California Apprenticeship Initiative, we are building RAPs for Applied Materials, Infinera, and Lam Research.

The arrival of Fan-Out Panel Level Packaging (FO-PLP) appears to be at a perfect time: This technology will leverage processes developed for Three Dimensional Stacked Integrated Circuits (3DS-IC) as well as panel processing technologies developed for industries such as solar panels and large-screen...