semiconductor packaging

SEMICON Europa 2022 (Munich, 15-17 November) attendees gathered at the Executive Forum for the Opening Ceremony on day one to hear from industry leaders and gain insights into the latest market and technology trends.

The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories. Facing...