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Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology

By Serena Brischetto
October 8, 2018
SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018, 13-16, November 2018, in...
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