finFET

The Scaling Technologies TechXPOT at this year’s SEMICON West (Scaling Every Which Way! – Thursday, July 12, 2:00pm-4:00pm) will explore traditional scaling as the industry marches toward 3nm and beyond, as well as technologies that enable 3D architectures, die stacking, and interconnect scaling....

With chipmakers looking toward 5nm manufacturing, it’s clear that traditional scaling is not dead but continuing in combination with other technologies. The industry sees scaling enabled by 3D architectures such as die stacking and the stacking of very small geometry wafers. Interconnect scaling...

The fast-maturing hardware and software that are enabling practical applications of equipment intelligence and machine learning mean disruptive change for microelectronics manufacturing. But first comes the basic work of building the basic infrastructure, figuring out IP separation, and learning to...