Debra Vogler

The Advanced Lithography TechXPOT at this year’s SEMICON West will explore progress in extreme ultraviolet lithography (EUVL), its economic viability for high-volume manufacturing (HVM) and other lithography solutions that will address the march to 5nm and onward to 3nm.As a prelude to the event,...

The Scaling Technologies TechXPOT at this year’s SEMICON West (Scaling Every Which Way! – Thursday, July 12, 2:00pm-4:00pm) will explore traditional scaling as the industry marches toward 3nm and beyond, as well as technologies that enable 3D architectures, die stacking, and interconnect scaling....

The Advanced Lithography TechXPOT at this year’s SEMICON West will explore progress in extreme ultraviolet lithography (EUVL), its economic viability for high-volume manufacturing (HVM) and other lithography solutions that will address the march to 5nm and onward to 3nm.As a prelude to the event,...

With chipmakers looking toward 5nm manufacturing, it’s clear that traditional scaling is not dead but continuing in combination with other technologies. The industry sees scaling enabled by 3D architectures such as die stacking and the stacking of very small geometry wafers. Interconnect scaling...

This year’s Advanced Lithography TechXPOT at SEMICON West will explore the progress on extreme ultra-violet lithography (EUVL) and its economic viability for high-volume manufacturing (HVM), as well as other lithography solutions that can address the march to 5nm and onward to 3nm. Several session...