inspection

The Advanced Lithography TechXPOT at this year’s SEMICON West will explore progress in extreme ultraviolet lithography (EUVL), its economic viability for high-volume manufacturing (HVM) and other lithography solutions that will address the march to 5nm and onward to 3nm.As a prelude to the event,...

New metrology and inspection technologies and new analysis approaches made possible by improving compute technology offer solutions to finding the increasingly subtle variations in materials and subsystems that meet specifications but still cause defects on the wafer. More collaboration across the...

The Scaling Technologies TechXPOT at this year’s SEMICON West (Scaling Every Which Way! – Thursday, July 12, 2:00pm-4:00pm) will explore traditional scaling as the industry marches toward 3nm and beyond, as well as technologies that enable 3D architectures, die stacking, and interconnect scaling....