R&D

SEMI has guided a proof-of-concept (POC) project since 2018 at Cornell University. Funded by the Army Research Labs to demonstrate an AI model that predicts the precise patterned features on the chip – the tinier and more precise the features, the higher the chip performance.

The U.S. Department of Commerce on February 28 opened the application process through the CHIPS Program Office for the initial tranche of funding under the $52 billion CHIPS Program – marking the first opportunity for SEMI members and other companies in the U.S. semiconductor supply chain to apply.

Recent semiconductor supply chain constraints have drawn the attention of Washington policymakers at every level. Exasperated by the global pandemic, customers of semiconductor manufacturers have sounded the alarm about the chip shortage and the downstream consequences for end-user companies and...

Over the next five years the Taiwan government plans to invest NT$1.546 billion to build the workforce direly needed for future semiconductor industry research and development. The largesse is a tribute to efforts by SEMI president and CEO Ajit Manocha to enhance the competitiveness of the...