3D Heterogeneous Integration

SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.SEMI: What are the AT&S AG mission and vision and your role within the company?Schrems: AT&S AG is...

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced Packaging...