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Industry Giants TSMC and Intel Vow to Focus on 3D IC Packaging

By Emmy Yi
June 26, 2019
Post-Conference Report: SEMI Heterogeneous Integration SummitDemand for high-performance computing (HPC) chips is exploding. These super-speedy chips are critical for data centers and cloud computing infrastructures to support new performance-hungry technologies such as artificial intelligence (AI)...
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Building Outside the Box: FLEX Conference 2019

By Heidi Hoffman
February 8, 2019
SEMI’s annual FLEX Conference & Exhibition returns to Monterey, California, February 18-21, 2019, bringing together nearly 100 speakers on the major developments at the leading edge of printed/flexible/hybrid sensors and electronics technology.The maturing technology for smarter sensors, in a...
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