Dresden

No one could have left the 3D & Systems Summit 2023 – held in late June in Dresden – with any doubt that heterogeneous integration, enabled by increasingly mature 3D packaging technologies, is becoming a key enabler of the semiconductor industry’s success in the years to come.

SEMI spoke with Dr. Franz Laermer, Research Fellow (Senior Chief Expert) at Robert Bosch GmbH Stuttgart, Corporate Sector Research and Advance Engineering, about the latest trends in medical diagnostics and personalized treatments. An open platform for the automation of complex molecular...

SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.SEMI: What are the AT&S AG mission and vision and your role within the company?Schrems: AT&S AG is...

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on in-process warp control, as well as the associated...

SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the 3D & Systems Summit, 28-30 January, 2019, in...