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Semiconductor Packaging Market Research

Summary

The electronics market sector is increasingly driven by consumer spending, where electronic products require more than performance and speed. Product look and feel, functionality, time to market, and cost are becoming critical factors, and packaging plays the major role in delivering solutions to meet these needs.

Consumer electronics are changing how semiconductor devices are thinned, die attached, bonding wire and encapsulated, with materials playing a major role enabling the development of newer packaging technologies. 

Typical Semiconductor Packaging Materials

  • Organic substrates
  • Leadframes
  • Mold Compounds
  • Underfill materials
  • Bonding wire
  • Liquid encapsulants 
  • Solder balls
  • Wafer level package dielectrics
  • Thermal interface materials
  • Die attach materials

A key business issue with a consumer electronics-driven market is that semiconductor and packaging in subcontractors are experiencing severe pricing pressure from their customers. Thus, manufacturers are pushing cost reduction at a faster pace to offset erosion in semiconductor average selling prices (ASP).

For the latest info, please view the info on this page as well as some of our products we have available for this market segment.

Packaging

Packaging

Worldwide Assembly & Test Facility Database, 2021 Edition

A comprehensive database covering more than 475 total back-end facilities of IDMs and outsourced semiconductor assembly...
December 31, 2021
Member | Non-member
Multi-user licenses are available

Global Semiconductor Packaging Materials Outlook (2020 to 2024)

A comprehensive study that examines the semiconductor packaging materials markets with forecast through 2024
July 30, 2020
Member | Non-member
Multi-user licenses are available