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Semiconductor Packaging Market Research


The electronics market sector is increasingly driven by consumer spending, where electronic products require more than performance and speed. Product look and feel, functionality, time to market, and cost are becoming critical factors, and packaging plays the major role in delivering solutions to meet these needs.

Consumer electronics are changing how semiconductor devices are thinned, die attached, bonding wire and encapsulated, with materials playing a major role enabling the development of newer packaging technologies. 

Typical Semiconductor Packaging Materials

  • Organic substrates
  • Leadframes
  • Mold Compounds
  • Underfill materials
  • Bonding wire
  • Liquid encapsulants 
  • Solder balls
  • Wafer level package dielectrics
  • Thermal interface materials
  • Die attach materials

A key business issue with a consumer electronics-driven market is that semiconductor and packaging in subcontractors are experiencing severe pricing pressure from their customers. Thus, manufacturers are pushing cost reduction at a faster pace to offset erosion in semiconductor average selling prices (ASP).

For the latest info, please view the info on this page as well as some of our products we have available for this market segment.



Global Semiconductor Packaging Materials Outlook (2023 to 2027)

A comprehensive study that examines the semiconductor packaging materials markets with forecast through 2027
March 24, 2023
Member | Non-member
Multi-user licenses are available

Worldwide Assembly & Test Facility Database, 2022 Edition

A comprehensive database covering more than 500 total back-end facilities of IDMs and outsourced semiconductor assembly...
December 19, 2022
Member | Non-member
Multi-user licenses are available