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SEMI Press Release
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions
MILPITAS, Calif. –– September 28, 2022 ––...
Member Press Release
PEER Group to showcase expertise at APCSM 2022
Kitchener, Ontario, September 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, is a proud sponsor and participant at this year’s Advanced Process...
Blog
Adding More Data Isn't the Only Way to Improve AI
Artificial Intelligence (AI) has the potential to transform society and business in the 21st century. AI has already been deployed to in smart homes, online shopping, natural language processing to...
SEMI Press Release
SEMICON Europa 2022 to Highlight Smart Mobility, Smart MedTech, Advanced Packaging, Fab Management, Materials, Sustainability and Talent
MUNICH, Germany ─ September 27, 2022 ─ Innovations in advanced technologies such as Smart Mobility, Smart MedTech, advanced packaging, fab management, materials, and other semiconductor industry...
SEMI Press Release
SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption
SAN JOSE and MILPITAS, Calif. — September 27, 2022 — The Autonomous Vehicle Computing Consortium (AVCC), a global group of automotive and technology industry leaders cooperating on expediting the...
Blog
SEMI Smart Manufacturing Initiative Works to Help Chip Industry Achieve Industry 4.0 Ambitions
The global semiconductor industry is poised to become a $1 trillion industry by 2030. Semiconductor sales and capital spending are expected to grow substantially in the coming decade with many new...
Blog
Welcome to Newest SEMI Americas Members!
The more than 2,500 SEMI member companies worldwide advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design,...
Member Press Release
Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products
Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released...
SEMI Press Release
Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
MILPITAS, Calif. — September 27, 2022 — Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in...
Member Press Release
Brewer Science presents advanced packaging innovations at SEMICON Taiwan 2022
Heterogenous integration in microelectronics requires advanced materials
Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation...
Member Press Release
MRSI launches new die bonders with improved accuracy
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the...
Member Press Release
Brooks Instrument Introduces Korean Language Website, Building on Commitment to Local Market
HATFIELD, Pa. (USA) September 13, 2022 — Brooks Instrument, a world leader in precision fluid measurement and control technology, has launched a Korean-language website to provide its Asia-Pacific...