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Modernized IC Test Using SEMI RITdb Standards

With product/die the focus in the test environment, SEMI is developing a suite of standards for the test industry built upon SEMI E183 – Specification for Rich Interactive Test Database (RITdb), which defines a data and event sharing and streaming methodology.

CHIPS Research and Development Standards Summit to Launch Effort to Speed Chip Innovation

The inaugural CHIPS Research and Development (R&D) Standards Summit will bring together thought leaders from industry and academia across the globe to help shape the future and drive innovation of semiconductor and microelectronics standards.

Legacy Software Is Not an IT Issue, But an Issue of Cybersecurity Depreciation

In January 2022, SEMI Taiwan released SEMI E187 – Specification for Cybersecurity of Fab Equipment. What cybersecurity pain points does SEMI E187 ultimately address?

SEMI Taiwan Sets Out to Help Secure Chip Manufacturing Supply Chain with Publication of First Fab Equipment Cybersecurity Specification

In Jan, SEMI published SEMI E187, a specification designed to help protect semiconductor manufacturing data. The publication marks the first time that SEMI Taiwan has led the development of an international standard and reflects the vital need for cybersecurity in Taiwan’s semiconductor industry.

SEMI EDA Standards Updates for Semiconductor Manufacturing Software Near Publication

At July's SEMI Standards Information & Control North America Technical Committee Chapter Meeting, several ballots passed procedural review and await publication. Among them are the Equipment Data Acquisition (EDA) Standards, which use the Freeze concept to identify a specific set of SEMI Standards.

The Gigafab Minute and SEMI Standards: A Modern Miracle

Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens...

Standard for Fan-Out Panel Size Ready to Ballot

The arrival of Fan-Out Panel Level Packaging (FO-PLP) appears to be at a perfect time: This technology will leverage processes developed for Three Dimensional Stacked Integrated Circuits (3DS-IC) as well as panel processing technologies developed for industries such as solar panels and large-screen...

Standards Industry Leaders Honored at SEMICON West 2018

Did you miss the SEMI International Standards Reception at SEMICON West 2018? Not to worry, here are the highlights.SEMI honored two Standards industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries.Two awards were given recognizing...