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Multi-Sensor Metrology Tools for Hybrid Metrology

SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a single-sensor approach.Fries offered his views ahead of the SEMI MEMS & Imaging Sensors Summit, 25 to...

Sensor Fusion: Indoor Localization and Augmented GPS Applications

Tracking and localization technologies typically integrate with Wi-Fi and Bluetooth signals to pinpoint the location of people and objects. But what if a venue can’t install beacons or routers, or afford to deploy Wi-Fi or Bluetooth networks? Thanks to a combination of proprietary algorithms,...

Talent and the Battle for Environmental Preservation

In 2016, the then-Secretary-General of the United Nations, Ban-Ki Moon, stated “Saving our planet, lifting people out of poverty, advancing economic growth. These are one and the same fight. We must connect the dots between climate change, water scarcity, energy shortages, global health, food...

Business Futures Shaping the Global Semiconductor Industry

MedTech, autonomous driving and other disruptive technologies will be in focus at the SEMI Industry Strategy Symposium (ISS Europe), 31 March - 2 April 2019 in Milan, Italy, as top European executives, researchers and academics gather to explore solutions to the region’s most pressing strategic,...

French Start-Up Moves to the Edge with Battery-Operated Devices

The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges in the digital economy. Serena Brischetto of SEMI spoke with GreenWaves Technologies CEO and co-founder Loïc Lietar about the...

Fan-Out System-in-Board Technology: Enabling RF and Processor Module and System-Level Integration

SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.SEMI: What are the AT&S AG mission and vision and your role within the company?Schrems: AT&S AG is...

Agile Manufacturing of Glass Carriers for Advanced Packaging

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on in-process warp control, as well as the associated...

Zero Energy Connection (0eC) - A New Way to Transfer Data

SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the 3D & Systems Summit, 28-30 January, 2019, in...

A New Collaborative Approach to Automobile Industry Reliability Challenges

SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” and the need for a collaborative approach ahead of his presentation at the Strategic Materials Conference at SEMICON Europa 2018, 13-16, November...

MEMS – One Product, One Process?

SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at the 22nd Fab Management...