After anchoring semiconductor industry growth for decades, Moore’s law is facing increasing cost and complexity challenges. APHI technologies have emerged as key to meeting the demands of next-generation electronics devices.
To help the semiconductor industry keep pace with increasing chip performance and cost demands, SEMI has formed the Advanced Packaging Heterogeneous Integration (APHI) Technology Community as part of our longstanding support of advanced packaging innovation through events and standards development.
Launched at SEMICON West 2023 in July, the APHI Technology Community has set out to drive awareness, adoption and interoperability of advanced packaging and heterogeneous integration technologies. Consisting of industry, academic and government experts, the group met to begin to define the APHI Technology Community vision and mission, including its pre-competitive focus and commitment to educating members and supporting global APHI technology development.
SEMI APHI Technology Community kick-off meeting at SEMICON West 2023.
Propelling APHI Education and Awareness
The APHI Technology Community aims to identify technology gaps, establish new standards to support technology development, and foster a deeper understanding of advanced packaging and heterogeneous integration technologies through SEMI University courses, conferences, and other forums. At SEMICON West 2023, the group established plans to develop a SEMI University course, in collaboration with IEEE EPS (Electronic Packaging Society), featuring an overview of the SEMI and IEEE EPS packaging roadmap. The APHI Technology Community also discussed strategies on how to include more startups to fulfill its awareness-building objectives.
Embracing a Pre-Competitive Spirit
A core tenet of the APHI Technology Community is to remain pre-competitive to encourage collaboration among members and enable joint efforts to drive technological advancements while respecting individual commercial interests. As part of its work to help drive innovation, the community will support member-driven technology and proof-of-concept projects. It will also serve as a resource to CHIPS-led efforts tied to planned institutes including the National Semiconductor Technology Center (NSTC), National Advanced Packaging Manufacturing Program (NAPMP), and Semiconductor Manufacturing USA.
Embracing Collaboration
Critically, the APHI Technology Community plans to include broad representation of the semiconductor supply chain including fabless and EDA companies and government partners to enhance its expertise and reach. By collaborating with academia and industry to develop standards and conducting industry gap analyses, the APHI Technology Community plans to work in coordination with other packaging organizations and societies. The prospect of collaborating with organizations such as IEEE and IEC brings exciting opportunities to collectively drive technological advancements and preliminary standards development.
Join the APHI Technology Community
SEMI invites chip industry stakeholders to join the APHI Technology Community to help build a thriving ecosystem of knowledge exchange and technology development. Together, we embark on a journey towards a brighter, interconnected future for APHI technologies. For more information or to participate, contact Mark da Silva of SEMI at aphi-tc@semi.org.
About the Authors
Mayura Padmanabhan is a Technical Project Manager who manages the Electronics Materials Group, Semiconductor Components, Instruments and Sub systems (SCIS) and the Collaborative Alliance for Semiconductor Test (CAST) Technology Communities at SEMI.
Mark da Silva, Ph.D. is Senior Director of the SEMI Smart Manufacturing initiative with expanded oversight of SEMI’s advanced packaging and heterogeneous integration initiatives.