advanced packaging

To help the semiconductor industry keep pace with increasing chip performance and cost demands, SEMI has formed the Advanced Packaging Heterogeneous Integration (APHI) Technology Community as part of our longstanding support of advanced packaging innovation through events and standards development. 

a memory market rebound will help spark a global semiconductor industry recovery poised to take hold in the second half of 2023 after the downturn that came on the heels of the pandemic boom, SEMI and major market research firms projected at Strategic Materials Conference (SMC) Korea 2023.

The SEMI FlexTech R&D program recently completed project FT19-19-190 with SAFI-Tech to create a solder material with a substantially lower melting point than conventional solder paste, reducing the thermal stresses created by high-temperature processing used for smaller packaging technologies.

For the semiconductor industry to flourish, all chip ecosystems must embrace closer ties, greater openness, and more flexibility to co-innovate solutions in today’s rapidly unfolding global digital transformation.

Humanity has survived almost unimaginable challenges over the past 5,000 years of documented human history. From war, famine and natural disasters to the first global pandemic in the last 100 years, more often than not, people have relied on one another to survive and thrive again. As the industry...

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid-...

SEMI has long promoted the industry collaboration that has contributed to the rise of the smart digital world we live in today. A world where data is being generated continuously by systems, gadgets, and sensors around us – often referred to as the Internet of Things (IoT). In our personal lives,...