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Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering |
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Count of semiconductor fabs using 300mm wafers projected to exceed 200 by 2026 |
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Legal proceedings initiated against RoodMicrotec GmbH regarding the perpetual bond issued in 2010 |
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RoodMicrotec enters into final settlement agreement with Robus regarding legal proceedings on perpetual bond |
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Rapid Silicon Chooses Verific’s Industry-Standard Parser Platform |
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Picosun delivers powder MEMS technology platform to Fraunhofer ISIT |
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Beneq unveils two new ALD products for 300mm and compound semiconductor device fabrication respectively |
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YES Establishes Engineering, Design and Sales Presence in India; Ankineedu Velaga to Lead YES India as Country Head and Managing Director |
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PEER Group celebrates 30th anniversary |
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Picosun and Shincron join forces for ALD optical coating development |
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Technic joins MATQu – European based project for quantum computing hardware eco-system |
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RoodMicrotec reports preliminary total income of EUR 14.5 million for 2021 |
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NucleiSys Adopts Breker’s System Coherency TrekApp |
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Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication |
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Elevate® Celebrates 10 Years of Accomplishments in Fabrication and Packaging Technology (2012-2022) |
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MPO 100 - Multi-User Tool for 3D Lithography and 3D Microprinting |
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Picosun part of extensive quantum technology development project |
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Stepping Towards Smart Manufacturing with ViTrox VR20i Post Seal Inspection Vision Handler Series |
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Wooptix introduces a patterned wafer geometry system for 300mm silicon wafers |
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Victor Huang Joins Yield Engineering Systems (YES) as VP of Legal Affairs |
