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PEER Group celebrates 30th anniversary |
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Picosun and Shincron join forces for ALD optical coating development |
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Technic joins MATQu – European based project for quantum computing hardware eco-system |
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RoodMicrotec reports preliminary total income of EUR 14.5 million for 2021 |
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NucleiSys Adopts Breker’s System Coherency TrekApp |
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Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication |
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Elevate® Celebrates 10 Years of Accomplishments in Fabrication and Packaging Technology (2012-2022) |
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MPO 100 - Multi-User Tool for 3D Lithography and 3D Microprinting |
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Picosun part of extensive quantum technology development project |
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Stepping Towards Smart Manufacturing with ViTrox VR20i Post Seal Inspection Vision Handler Series |
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Wooptix introduces a patterned wafer geometry system for 300mm silicon wafers |
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Victor Huang Joins Yield Engineering Systems (YES) as VP of Legal Affairs |
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Reed McKissick Joins Fit-Line Global as New Mechanical Engineer |
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RoodMicrotec and AEM announce strategic cooperation in the Central European market |
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YES (Yield Engineering Systems, Inc.) Acquires SPEC (Semiconductor Process Equipment Corp.) |
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Dr. Anirudh Devgan Honored With 2021 Phil Kaufman Award |
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Lanza techVentures Names Rick Carlson Investment Partner |
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Picosun to introduce novel coating solution for organic electronics |
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Covalent Metrology and JEOL Announce Partnership, Silicon Valley Demonstration Facility |
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DataProphet Extends Semiconductor Advisory Board with new Industry Veteran |
