downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

IC Design Crashes Into the 3D Wall: Multiphysics Platforms Ride to the Rescue

Three-dimensional integrated circuits (3D-ICs) are revolutionizing the semiconductor industry. Manufactured by stacking and interconnecting dies so they perform as a single device, 3D-ICs deliver more capabilities by offering higher performance and bandwidth — while also reducing power consumption,...

Exploring the Move to Bespoke Silicon and 3D IC Designs with Ansys

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through...