CPU

Dr. Prakash Narain, president and CEO of Real Intent and a member of the ESD Alliance Governing Council, recently offered insights on the vexing functional verification challenges that consume a significant portion of the chip design cycle.

Vikram Bhatia, Director of the Synopsys Cloud Go-to-Market and Product Strategy, discusses leveraging a flexible, pay-per-use approach to fuel the next phase of semiconductor innovation - bring your own cloud (BYOC) and software as a service (SaaS) deployment model.

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are...