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Semiconductor Manufacturing, Supply Chain Challenges and Startups in France: Aselta Weighs in

The increasing complexity of IC manufacturing poses a number of challenges including the mask data preparation required to enable technology improvements such as multi-beam (MB) mask writers and extreme ultraviolet (EUV) lithography. Thiago Figueiro, VP of Sales & Marketing of Aselta weighs in.

3D-IC: Great Opportunities, Great Challenges

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.

The Future of MEMS

Despite market saturation and stagnation saddling many business sectors, MEMS remains a shining star in the semiconductor industry. Opportunities in automotive, consumer electronics, mobile, medical are rising. What is supporting this industry growth? Who are the big players on the horizon?SEMI...

SEMI China Members Day 2019 — Robust Supply Chain Key to Buildout of China’s Semiconductor Industry

Shenyang is on an unwavering path to maturing its integrated circuit (IC) equipment manufacturing industry over the next few decades in response to the Made in China 2025 Strategy. Since the strategy’s introduction in 2015, the city, long a transportation and commercial hub of China's northeast,...

The Importance of a Well-Coordinated Semiconductor Supply Chain

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket?  If yes, you may find the sausage being too small, the veggies too big for the bun, and,...

Enabling IoT Design with Integrated MEMS/IC Co-Design and Verification

Creating a custom Internet of Things (IoT) IC is challenging because it involves multiple design domains (digital, analog and RF). Creating a sensor-based IC that combines electronics that use the traditional CMOS IC design flow with a MEMS sensor on the same silicon die, however, can seem...

Advanced Testing Paradigm Shifting in Era of Heterogeneous Integration

New SEMI Taiwan Testing Committee to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.Mobile, high-performance computing (HPC), automotive, and IoT – the four future growth drivers of semiconductor industry, plus the additional boost from...

SEMI China Delegation Searches for the Secret of Japan’s “Silicon Island”

Kyushu, the third largest island in Japan, is home to the semiconductor production bases of integrated device manufacturers (IDMs) with world-class cutting-edge technology. SONY, Toshiba, Hitachi, Mitsubishi, Fujitsu and Nissan are among the sector’s shining stars, though a host of other IDMs tied...

Cybersecurity and Industry-Government Collaboration Hot Topics at MEMS & Sensors Executive Congress 2018

SEMI-MEMS & Sensors Industry Group (MSIG) welcomed a global group of industry executives to its 14th annual MEMS & Sensors Executive Congress (MSEC), October 29-30, 2018 in Napa, Calif. MEMS and sensors represent a robust sector of the electronic industry. Analyst firm Yole Développement...

MEMS – One Product, One Process?

SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at the 22nd Fab Management...