chiplets

I recently spoke with Shi about his talk Looking Forward to the New Chip Cycle during the opening of the 2023 Design Automation Conference, collocated in July with SEMICON West in San Francisco.

Industry experts gathered at the Heterogeneous Integration Summit at SEMICON Taiwan 2022 to offer perspectives on how the growing chiplet ecoystem can work together to overcome headwinds to chiplet innovation. 

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.

Anna Fontanelli, Monozukuri’s founder and CEO, is an expert in deep-submicron silicon technology and design tools shares her view on the state of Moore’s Law and challenges surrounding 2.5D integration, 3D chip stacking & advanced packaging, as well as the chip design industry’s startup environment.

The year 1981 was notable for a variety of technology breakthroughs. Few could have predicted just how dramatic an impact the global electronics industry would have in the following 40 years, as it now touches almost every aspect of our daily lives.

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are...