multiphysics

Cultivating trust and keeping his team agile and innovative as they engage with technology partners and customers is a core focus of John Lee, General Manager and Vice President of the Ansys Electronics, Semiconductors, and Optics Business Unit.

As an industry, we must collaborate because it’s going to take a village to solve Multiphysics, which in turn is the key to growth in 3D IC. No individual company can compete on every front.

A critical foundation for success in this new multiphysics reality is the development of open, extensible and cloud-optimized platforms that enable many different tools and data sets to work together and build towards a realistic and accurate simulation of physical reality.

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.

Three-dimensional integrated circuits (3D-ICs) are revolutionizing the semiconductor industry. Manufactured by stacking and interconnecting dies so they perform as a single device, 3D-ICs deliver more capabilities by offering higher performance and bandwidth — while also reducing power consumption,...

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through...