Technology and Trends

Rick Eram, Excellicon’s VP of sales and operations, discusses ways for designers to compare the physical floorplan against the actual register transfer level (RTL) code and constraints, chip design trends and complexity, and a few of his predictions for the design and verification market.

Vikram Bhatia, Director of the Synopsys Cloud Go-to-Market and Product Strategy, discusses leveraging a flexible, pay-per-use approach to fuel the next phase of semiconductor innovation - bring your own cloud (BYOC) and software as a service (SaaS) deployment model.

More consumer and industrial products may emit volatiles that now are known to be harmful, including furniture, passenger cars, and industrial trucks. Interest in detecting and measuring the gaseous pollutants is growing in order to create effective responses to reduce or eliminate health risks. 

In January 2022, SEMI Taiwan released SEMI E187 – Specification for Cybersecurity of Fab Equipment. What cybersecurity pain points does SEMI E187 ultimately address?

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

Since the release of ISO 27001, a raft of new international information security standards have emerged. Within the trend of cyber/digital resilience, how exactly do senior executives understand the latest cybersecurity standards from a management perspective?

Jens Fabrowsky, executive VP of Automotive Electronics at Robert Bosch GmbH, spoke about changes in the European electronics industry necessary for the region to become more resilient, sharing his views during the panel discussion at SEMI ISS Europe on May 30 2022 in Brussels, Belgium.

The Pact for Skills aims to support upskilling and reskilling and generate European, national and regional funding to attract new talent. Launched by commissioners Breton and Schmit, the Pact makes it a priority to create a well-skilled workforce in microelectronics R&D, design, and manufacturing.

Guido D’hert, High Tech and Semiconductor Industry Europe Lead at Accenture, spoke about challenges semiconductor companies face in meeting sustainability goals and how to apply analytics, new green technologies and circular design, sharing during his presentation at ISS Europe in Brussels, Belgium.

A critical foundation for success in this new multiphysics reality is the development of open, extensible and cloud-optimized platforms that enable many different tools and data sets to work together and build towards a realistic and accurate simulation of physical reality.