3D IC

Cultivating trust and keeping his team agile and innovative as they engage with technology partners and customers is a core focus of John Lee, General Manager and Vice President of the Ansys Electronics, Semiconductors, and Optics Business Unit.

I recently spoke with Shi about his talk Looking Forward to the New Chip Cycle during the opening of the 2023 Design Automation Conference, collocated in July with SEMICON West in San Francisco.

As an industry, we must collaborate because it’s going to take a village to solve Multiphysics, which in turn is the key to growth in 3D IC. No individual company can compete on every front.

Charles Shi, Principal, Senior Analyst, Needham & Company, LLC., recently offered an upbeat assessment of the electronic design automation (EDA), silicon intellectual property (IP) and services industries, or what SEMI refers to as the electronic system design (ESD) ecosystem.

Three-dimensional integrated circuits (3D-ICs) are revolutionizing the semiconductor industry. Manufactured by stacking and interconnecting dies so they perform as a single device, 3D-ICs deliver more capabilities by offering higher performance and bandwidth — while also reducing power consumption,...

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through...

For many technologies, standards unshackle them from patents and enable their mass production – an idea close to the heart of Wendy Chen, associate vice president of the R&D Center at King Yuan Electronics Corp. and vice chair of the SEMI Taiwan Test Committee. More importantly, standards are...

Post-Conference Report: SEMI Heterogeneous Integration SummitDemand for high-performance computing (HPC) chips is exploding. These super-speedy chips are critical for data centers and cloud computing infrastructures to support new performance-hungry technologies such as artificial intelligence (AI)...

New SEMI Taiwan Testing Committee to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.Mobile, high-performance computing (HPC), automotive, and IoT – the four future growth drivers of semiconductor industry, plus the additional boost from...