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Needham & Company Senior Analyst Charles Shi on EDA Powering Through Semiconductor Industry Cycles

Charles Shi, Principal, Senior Analyst, Needham & Company, LLC., recently offered an upbeat assessment of the electronic design automation (EDA), silicon intellectual property (IP) and services industries, or what SEMI refers to as the electronic system design (ESD) ecosystem.

High-Voltage Power Technologies Drive Next-Generation Semiconductor Processes

The global chip shortages together with the growing trends of electrification and digitalization have heightened awareness of the world’s reliance on semiconductors. Global management consultancy McKinsey & Company predicts a decade of growth leading to a $1 trillion semiconductor industry by 2030.

Atomic Layer Deposition Expected to Grow to Meet Demand for More-than-Moore Devices and Applications

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

Open Platforms are the Foundation for Advanced System Design

A critical foundation for success in this new multiphysics reality is the development of open, extensible and cloud-optimized platforms that enable many different tools and data sets to work together and build towards a realistic and accurate simulation of physical reality.

Electrostatic Energy Drives Higher Power-Efficiency and Performance in Chip Design

Azeez Bhavnagarwala, Metis’ founder and CEO, speaks about advanced CMOS Memory and Arithmetic component intellectual property (IP) to improve energy efficiency and performance of processors.

Conquering 2.5D and 3D Chip Design Challenges with Monozukuri

Anna Fontanelli, Monozukuri’s founder and CEO, is an expert in deep-submicron silicon technology and design tools shares her view on the state of Moore’s Law and challenges surrounding 2.5D integration, 3D chip stacking & advanced packaging, as well as the chip design industry’s startup environment.

Open Source EDA, IP, Cloud-Based Design, Extending Moore’s Law: Pedestal Research’s Laurie Balch Talks Chip Design Trends

As a leading analyst covering the electronic system design segment, Laurie Balch is well steeped in identifying and analyzing technology trends and forecasting new market opportunities. Laurie is now President and Research Director at Pedestal Research.

Cadence at Forefront in Speeding Chip Design with Machine Learning

Machine learning (ML) and artificial intelligence (AI) have ushered in tremendous opportunities for faster growth, problem-solving and technological development in the electronic system design ecosystem. Cadence Design Systems, Inc., a member of the ESD Alliance, a SEMI Technology Community, is at...

For Moore’s Law to Live, SoCs Must Die

Throughout the current millennium, System-on-Chip (SoC) has been the gold standard for optimizing performance and cost of complete electronic systems. By incorporating practically all the phone’s digital plus analog capabilities onto a single, giant chip, the mobile phone processor serves as a...

Intel Sets Out to Tackle Power Delivery Challenges for Heterogeneous Systems

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are...